| PART |
Description |
Maker |
| 0022283302 42225-0100 A-42225-0100 22-28-3302 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Polarizing Wall, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, with Polarizing Wall, 30 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, with Polarizing Wall, 30 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 85013-3081 0850133081 |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛) Selective Gold (Au), 96 Circuits
|
Molex Electronics Ltd.
|
| 90147-1103 0901471103 |
2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Vertical, 3 Circuits
2.54mm (.100) Pitch C-Grid垄莽 PC Board Connector, Single Row, Vertical, 3 Circuits
|
Molex Electronics Ltd.
|
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0015910120 015-91-0120 71308-0112N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0015910140 015-91-0140 A713080114N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 22-28-0067 |
2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, with Friction Lock, 6 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0022283191 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Polarizing Wall, 19 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, with Polarizing Wall, 19 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 22-28-3271 42225-0062 A-42225-0062 |
2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, with Polarizing Wall, 27 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Polarizing Wall, 27 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
|
